Our standard services
X-ray & quality assurance
- BGA soldered optimally?
- Soldering joints bubble-free?
- Potted components damaged?
We provide distinctness, prepare the related reports and give indications how to avoid rejects in the future!
Washing & cleaning
The easiest way to avoid corrosion-related disturbances, such as gaps, signal distortions, leakage currents or electrochemical migration.
Be sure, we match the cleaning process to your assembly!
Repairs & Rework
- Wrong component/BGA soldered?
- Assembly of "forgotten" SMD/THT components
- Hand soldering and selective soldering
- Samples and small series
- Repair of gold contacts and gold surfaces
We save your assembly. If it has to be, even overnight!
Our service for you
The flexible problem solver
Unlike others, we never say never. Our customers know: this is not an empty promise. After all, electronics production has been at home here in Zandt for over 50 years.
Admittedly, we are a bit proud of our self-developed thermal process for the repair of gold contacts and gold surfaces. Solder splashes and contamination by tin can be removed without residue. Of course, without affecting or even deforming the nickel layer (no grooves). Subsequently, the area is electrolytically gold plated. And best of all, the process is IPC compliant!
The proverbial soft water of the Bavarian Forrest is not only suitable for brewing excellent beers. With the right cleaning chemistry, there simply will not be any residue left on your assembly. Take the test!
Just took your eye off the ball for a few seconds - and now 120 boards carry the wrong BGA. We swap them. Maybe others can do that, too. But we X-ray the PCBs afterwards and prove the perfect soldering individually.